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Learning About the Latest Electronic Components and Market Solutions Has Never Been Easier!
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A New PGS Thermal Interface Material (TIM) Solution Designed Specifically For
Use With IGBT Modules!
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“Soft PGS” has high compressibility characteristics to reduce contact thermal resistance between rough surfaces in thin spaces. It contributes to long life and increased performance of power modules by providing high thermostability and reliability in thermally sensitive areas.
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More About The EYG-S Series
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As design standards continue to increase, the common methods of heat transfer are failing to address today’s thermal issues. Panasonic is a proud global Thermal Management supplier with a diversified portfolio that can challenge the thermal concerns of today and tomorrow.
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Learn More
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Check Out All Panasonic Thermal Management Solutions!
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A new heat isolating Thermal Management material from Panasonic.
Don’t Just Spread Heat … Isolate It With NASBIS!
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Introducing the ERJ-PB3 and PB6 Series High Precision Thick Film Chip Resistors. Choose these series for applications requiring a high precision Resistor with higher power.
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ERJ-PB3 and
ERJ-PB6 Series ►
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EXPLORE PAST ISSUES OF WHAT’S NEXT
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© 2017 Panasonic Corporation of North America. All Rights Reserved.
Two Riverfront Plaza, Newark, NJ 07102
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